How do you define it? Spherical Quartz Powder ? The sphere of quartz is made out of quartz crystal after it has been purified and fine ground. During a high-temperature field its phase, crystal forms and form change instantly from solid state into molten and finally back to solid state. Amorphous powder is made of irregularly formed angular particles that are transformed into regular spherical ones.
Here are some of the key features Spherical Quartz Powder
Smooth surface, high specific area and chemical stability are some of the benefits that spherical Quartz powder offers. Spherical quartz powder exhibits good fluidity and is mixed well with the resin in order to form a thin film. A higher amount of quartz powder is better for electronic components. It will also have a lower thermal conductivity. Also, the mold compound has a smaller thermal expansion factor. The stress of spherical granules is 60% less than that of angular powder. Furthermore, the molding compound made with spherical quartz crystal powder has both the lowest stress concentration and highest strength. The surface texture of spherical quartz powder is extremely smooth. It has low friction and wear, which may extend its service life by up to one-third.

Spherical Quartz Powder Spherical SiO2 Property
Other Titles	Fused quartz, spherial quartz, spherical SiO2, silica
	7631-86-9
Compound Formula	SiO2
Molecular Weight	60.09
Appearance	Powder White
Melting Point	1,600deg C (2,912deg F)
Solubility In Water	N/A
Density	2533 kg/m3
Purity	99.5-99.9%
Particle Size	10-30nm
Boling point	2,230deg C (4,046deg F)
Specific Heat	N/A
Thermo Conductivity	N/A
Thermal Expansion	N/A
Young’s Module	N/A
Exact	59.9668 g/mol
Monoisotopic	59.967 D

Spherical Quartz powder’s uses
There are many uses for spherical powdered quartz, with electronic packaging being the most popular. Electronic packaging is an industry that supports integrated circuits. As integrated circuits become increasingly sophisticated, the demands for packaging materials increase. Packaging forms are continually optimized and improved to meet these requirements. Three main types of electronic packaging include substrate, plastic, glue, and frame. The advantages of plastic packaging include its ease-of-use, low cost and ability to be made in mass quantities. Plastic packaging is responsible for approximately 95% of all integrated circuits worldwide. %above. EMC is the main plastic encapsulant. It houses more than 95% microelectronic component.
1. Microelectronic packaging must be able to withstand high humidity, low stress, low pressure, low alpha-rays, dip and reflow welding resistance, as well as good sealing properties. To address this issue, epoxy molding compounds must contain inorganic fillers. The most common inorganic materials used currently are nearly all quartz micropowder, or silicon micropowder. Large-scale, ultra-large-scale microelectronics circuits now have more stringent requirements for packaging material. EMC powder, which is an important supporting material, requires quartz powder to be of the required particle size. Quartz powder also needs its purity.
2. It is a sphere of silicon micropowder that has a good form and can be used to meet the technical needs of high-end integrated systems. This can reduce the temperature expansion coefficient, dielectric constant, and stress of sealing materials. The products also have excellent weather resistance, impact resistance and compression resistance. Spherical quartz can be used not only in electronic packaging, but also in high-end cosmetics manufacturing, electronic inks, laser fibers, electronic components and precision grinding, as well as in fillers for paints.
Source: Spherical Quartz Powder
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