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bismuth tin alloy

American Elements offers bismuth tin alloy in a variety of forms, including bar, ingot, ribbon, wire, shot, sheet and foil. These high purity metals are typically shipped immediately and are available in most volumes.

Stencil Cleaning: For stencils of 20 mil pitch and finer, surface area reduction is necessary to prevent solder balling and bridging from occurring as a result of hot slump during reflow (see the Stencil Aspect Ratio Table). The amount of reduction necessary depends on the process but is usually around 5-15%.

Using an Automated Stencil Cleaning System: For stencils with narrower and thinner apertures, the use of an automated stencil cleaning system can help reduce the risk of additional flux balls from the stencil being used on a finer surface and can be performed at a constant rate to prevent any depletion of the fluxing capacity. Many commercially available stencil cleaning formulations are available and work well with most processes.

Tribological and Tensile Properties: Several tests were conducted on the Sn, Bi and Sn-Bi coatings to evaluate their tribological properties. The results showed that the Sn-Bi coatings had a good friction coefficient, with negligible wear rates and a low wear volume. The Bi-Sn coatings also showed excellent tribo-mechanical performance and were considered to be potential candidates for the development of lead-free solders.

Basalt Fiber/Bi-Sn Composites: The BF/Bi-Sn composites were successfully fabricated and the tribo-mechanical properties of the alloy composites improved with an increase in the Bi-Sn content. This was attributed to the interaction of the Sn-Bi coatings with the surface of the BF.